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Brand Name : HUASWIN
Model Number : HSPCBA2001
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
PCB Fabrication Service PCB Board Assembly For Driver / LED Controller
PCB Assembly services:
SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering
Material Sourcing 
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
·Checks for solder paste 
·Checks for components down to 0201" 
·Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
·BGAs 
·Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems. 
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole | 
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free | 
| 3 | Components | Passives Down to 0201 Size | 
| BGA and VFBGA | ||
| Leadless Chip Carries/CSP | ||
| Double-Sided SMT Assembly | ||
| Fine Pitch to 08 Mils | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement-Same Day Service | ||
| 3 | Bare Board Size | Smallest:0.25x0.25 Inches | 
| Largest:20x20 Inches | ||
| 4 | File Formats | Bill of Materials | 
| Gerber Files | ||
| Pick-N-Place File(XYRS) | ||
| 5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment | 
| 6 | Component Packaging | Cut Tape | 
| Tube | ||
| Reels | ||
| Loose Parts | ||
| 7 | Turn Time | 15 to 20 days | 
| 8 | Testing | AOI inspection | 
| X-Ray inspection | ||
| In-Circuit testing | ||
| Functional test | 
|   | 
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